France’s semiconductor funding under France 2030 represents the program’s most commercially consequential single-sector investment. With over €3 billion in direct France 2030 allocation, combined with €1.2+ billion in EU Chips Act / IPCEI co-funding and over €3 billion in private co-investment, the total public-private investment in French semiconductors through 2030 exceeds €7.5 billion — the largest concentrated technology investment in French industrial history.

This tracker covers all major funding commitments, competition results, and company-level investment data as of Q1 2026.

Master Funding Summary

Company-Level Commitments

STMicroelectronics — Crolles Expansion

Total investment: €7.5 billion (joint with GlobalFoundries) Public support component: €2.9 billion France 2030 grants + €300 million EU Chips Act Employment: +1,000 direct jobs at Crolles (on top of 4,800 existing) Technology: 300mm FD-SOI wafer processing, automotive-grade and IoT chips Timeline: Production qualification Q4 2024, full ramp 2026-2027

STMicro is France 2030’s largest single semiconductor beneficiary. The company’s total French manufacturing footprint — including the Rousset (near Aix-en-Provence) and Tours plants, plus Crolles — generates approximately €4 billion in French semiconductor revenues annually. The Crolles expansion is expected to add €1-1.5 billion in annual French revenue by 2028.

Nano 2030 Program: STMicro is the primary industrial partner in Nano 2030, the five-year collaborative R&D program between CEA-Leti, STMicro, and GlobalFoundries. Total program cost: €2 billion. French state contribution: €800 million. The program develops next-generation FD-SOI processes and heterogeneous integration capabilities.

GlobalFoundries — Crolles Joint Investment

Total investment: Part of the €7.5B joint fab (GlobalFoundries contributing approximately €2-2.5B) Public support: Included in the joint €2.9B France 2030 grant Technology: FD-SOI 22nm and 18nm, RF-SOI for 5G Commercial rationale: GF gains European manufacturing presence for automotive and IoT customers; France gains a second-anchor tenant for Crolles

Soitec — Bernin Capacity Expansion

Total investment: €1.5 billion (2022-2027) Public support: €175M France 2030 state aid (Chips Act Pillar II) + €120M IPCEI ME2 Employment: +1,500 jobs at Bernin (doubling existing workforce) Technology: 300mm SOI wafers for FD-SOI, RF-SOI, and SOI-based photonics Timeline: Phase 1 capacity addition operational Q2 2025; Phase 2 completion 2027

Soitec’s global market share in SOI wafers (approximately 80%) gives it a near-monopoly pricing position that makes the capacity expansion financially compelling independent of public support. France 2030 funding de-risks the investment against demand cyclicality.

CEA-Leti — Nano 2030 Research Platform

Nano 2030 allocation: €320M France 2030 + €1.2B EU Chips Act share Research focus: Advanced nodes (10nm and below FD-SOI), silicon photonics, heterogeneous integration, quantum chips Output targets: 200 new patents annually, 50 industrial partner R&D agreements, 10 startup spinouts per year from 2025-2030

CEA-Leti is the research engine of the French semiconductor ecosystem. Its Nano 2030 program aligns research roadmaps with industrial partners to ensure French process technology remains competitive with IMEC (Belgium), Fraunhofer-EMFT (Germany), and imec.IC-link (Netherlands).

X-FAB — Corbeil-Essonnes Modernization

Investment: €90M total Public support: €45M France 2030 grant Technology: Specialty analog/mixed-signal, MEMS, automotive SiC Employment: +150 jobs

X-FAB’s Corbeil-Essonnes fab (Essonne department, south of Paris) is one of France’s secondary semiconductor manufacturing sites, specializing in analog and MEMS chips for automotive and industrial applications. The France 2030 grant funded clean room upgrade and new SiC (silicon carbide) process qualification — enabling X-FAB France to serve the growing market for SiC chips in EV power electronics.

LFoundry — Rousset

Investment: €60M modernization Public support: €25M France 2030 grant Technology: 110nm-200nm CMOS, image sensors, defense Employment: +80 jobs

LFoundry, an Italian-headquartered specialty foundry with major operations at the former Atmel (now Microchip) facility in Rousset near Aix-en-Provence, manufactures specialty chips for defense, space, and industrial applications. France 2030 support was specifically tied to defense supply chain sovereignty — LFoundry Rousset is one of two French facilities certified to manufacture chips for classified defense applications.

Thales — GaN Power Semiconductors (IPCEI ME2)

IPCEI ME2 funding: €85M French state aid Technology: Gallium Nitride on Silicon (GaN-on-Si) for phased array radar and 5G power amplifiers Location: Thales’s Limeil-Brévannes research and manufacturing site Significance: Defense-grade GaN is a technology France explicitly cannot source from Asian suppliers; domestic capability is a national security imperative

Startup Funding: Bpifrance Semiconductor Portfolio

Bpifrance’s direct semiconductor investment (equity, convertible loans, grants) through France 2030:

Budget Deployment Progress

Deployment is weighted toward 2025-2027 as construction milestones trigger disbursement tranches. Budget deployment percentage of 63% by Q1 2026 is on plan.

Related: Crolles-Grenoble Cluster | European Chips Act and France | Semiconductor Scorecard | Silicon Photonics